Reading the MCIMX50 Application Processor Reference Manuals on page 1368 (Section 33.3) there is a list of the different possible control functions of the processors pads.
The list is:
Can someone explain what each one of these are, preferably in an educative manner with links to additional information?
Thanks in advance.
SRE (1 bit slew rate control) - How fast the pin state changes from 0 to 1, since rapidly changing states takes more power & emits RF spikes, slowing it down if you can helps EMC. We run most of our GPIO pins at low slew rate apart from SPI & I2C which need to be fast.
DSE (2 bits drive strength control). - How much current the IO pin will source/sink, again a power-saving / EMC thing as it's generally bad practice to hang loads directly from micro pins.
ODE (1 bit open drain control). - Whether the pin pulls down to 0V for a low output or goes "open drain" (disconnected/floating), this is useful for some things like I2C where parts take it in turns to hold lines low or high.
HYS (1 bit hysteresis control). - Look up Hysteresis on wikipedia, should tell you all you need to know.
Pullups/downs etc. - basically whether the pin has an internal resistor connected to +v or 0v to stop things floating to some random/undesired value, usually used when the pin is an input.
DDR_MODE_SEL (1 bit ddr_mode control) - Probably Data Direction Register, in other words is the pin an input or output
DDR_INPUT (1 bit ddr_input control) - Not sure, the micro reference manual should give you some clue to this and all the others.
Hope this helps!